Apple announces succession: Tim Cook will leave command and John Ternus will be new CEO Apple plans to invest more than US$30 billion (approximately R$155.4 billion, considering the dollar at R$5.18) in a chip purchase agreement signed this week with Broadcom. The contract also provides for the expansion of a semiconductor manufacturer's factory in Colorado, in the United States, according to information released by the companies this Wednesday (8). Partnership was built in 2023 On Monday (6), Broadcom announced a long-term chip supply agreement with Apple, valid until 2031. Two days later, Apple reported that the contract involves the production of a radio frequency chip called an FBAR filter, a component responsible for helping the company's devices connect to wireless networks. The development of this technology has been carried out in partnership between Apple and Broadcom since at least 2023. As part of the agreement, Broadcom will invest US$1.5 billion (R$7.77 billion) in the expansion of a factory located in Fort Collins, Colorado. Apple stated that the contract provides for the manufacture of at least 15 billion chips and is part of a strategy to increase the purchase of semiconductors produced in the United States, in partnership with President Donald Trump's government. "Advanced components manufactured in Fort Collins are essential to delivering the performance and connectivity our customers expect. We are proud to expand our investments in U.S.-based suppliers who share our commitment to excellence and innovation," Apple Chief Executive Tim Cook said in a statement. “We are grateful to the president and his government for supporting important projects like this,” he added.
Apple closes R$155 billion deal to manufacture chips in the USA
Apple announces succession: Tim Cook will leave command and John Ternus will be new CEO Apple plans to invest more than US$30 billion (approximately R$155.4 billion, considering the dollar at R$5.18) in a chip purchase...
This story was originally published by G1 Tecnologia. Visit the original publication for further details.
Open original publication